MC8610TPX1066JB 製品情報|NXP

特徴


REV 1.1, 8610, 1.0V,-40C/105C

パッケージ


BGA783: BGA783, plastic, ball grid array; 783 balls; 1 mm pitch; 29 mm x 29 mm x 2.7 mm body

購入オプション

MC8610TPX1066JB

生産終了 (EOL)

12NC: 935325449557

詳細

注文

操作機能

パラメータ
Security Status
COMPANY PUBLIC
Description
REV 1.1, 8610, 1.0V,-40C/105C
パラメータ
Number of pins
783
Package Style
BGA

環境

Part/12NC鉛フリーEU RoHSハロゲンフリーRHFインジケーター2次インターコネクトREACH SVHCWeight (mg)
MC8610TPX1066JB(935325449557)
No
No
Yes
N
e0
REACH SVHC
3803.3

品質

Part/12NC安全保障機能安全吸湿感度レベル (MSL)Peak Package Body Temperature (PPT) (C°)Maximum Time at Peak Temperatures (s)
鉛はんだ鉛はんだ鉛フリーはんだ鉛はんだ鉛フリーはんだ
MC8610TPX1066JB
(935325449557)
No
3
245
245
30
30

配送

Part/12NC関税分類番号(米国)免責事項:輸出規制品目番号(米国)
MC8610TPX1066JB
(935325449557)
854231
3A991A1

製品変更のお知らせ

Part/12NC発行日有効期限PCNタイトル
MC8610TPX1066JB
(935325449557)
2020-12-152020-12-16202011011INXP Will Add a Sealed Date to the Product Label

詳細 MPC8610

The MPC8610 processor is engineered to deliver breakthrough performance, connectivity and integration for embedded applications that process or display graphical images, such as kiosks, robotics, in-vehicle infotainment, cockpit displays, single-board computers and multi-function printers and scanners.

The MPC8610’s strength is its integration—the high-performance e600 core built on Power Architecture® technology—combined with the PowerQUICC® system-on-chip (SoC) platform and an LCD controller. With e600 core performance and integrated northbridge and southbridge functionality, the single chip replaces what could take up to four chips using other solutions. Moving all core-to-peripheral connections inside the device greatly reduces the number of high-speed parallel busses to be routed on the circuit board. This translates into smaller boards with fewer layers and higher processing density.