728-960 MHz, 2.5 W Avg., 28 V RF LDMOS Wideband Integrated Power Amplifiers

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Features

  • Characterized with Series Equivalent Large-Signal Impedance Parameters and Common Source S-Parameters
  • On-Chip Matching (50 Ohm Input, DC Blocked)
  • Integrated Quiescent Current Temperature Compensation with Enable/Disable Function
  • Integrated ESD Protection
  • Designed for Digital Predistortion Error Correction Systems
  • Optimized for Doherty Applications
  • 225°C Capable Plastic Package
  • RoHS Compliant
  • In Tape and Reel. R1 Suffix = 500 Units, 44 mm Tape Width, 13-inch Reel.

RF Performance Tables

Driver Application - 900 MHz

Typical Single-Carrier W-CDMA Performance: VDD = 28 Volts, IDQ1(A+B) = 58 mA, IDQ2(A+B) = 222 mA, Pout = 2.5 Watts Avg., IQ Magnitude Clipping, Channel Bandwidth = 3.84 MHz, Input Signal PAR = 7.5 dB @ 0.01% Probability on CCDF.
  • Capable of Handling 10:1 VSWR, @ 32 Vdc, 940 MHz, 25 Watts CW Output Power (3 dB Input Overdrive from Rated Pout)
  • Typical Pout @ 1 dB Compression Point 26 Watts CW

Driver Application - 700 MHz

Typical Single-Carrier W-CDMA Performance: VDD = 28 Volts, IDQ1(A+B) = 58 mA, IDQ2(A+B) = 222 mA, Pout = 2.5 Watts Avg., IQ Magnitude Clipping, Channel Bandwidth = 3.84 MHz, Input Signal PAR = 7.5 dB @ 0.01% Probability on CCDF.

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N true 0 PSPMD8IC925Nja 10 アプリケーション・ノート Application Note t789 6 データ・シート Data Sheet t520 1 パッケージ情報 Package Information t790 2 ホワイト・ペーパ White Paper t530 1 ja ja ja データ・シート Data Sheet 1 1 1 English The MD8IC925N wideband integrated circuit is designed with on-chip matching that makes it usable from 728 to 960 MHz. This multi-stage structure is rated for 24 to 32 volt operation and covers all typical cellular base station modulation formats. 1369954385248726501985 PSP 827.0 KB None None documents None 1369954385248726501985 /docs/en/data-sheet/MD8IC925N.pdf 827049 /docs/en/data-sheet/MD8IC925N.pdf MD8IC925N documents N N 2016-10-31 MD8IC925N 728-960 MHz, 2.5 W Avg., 28 V Data Sheet /docs/en/data-sheet/MD8IC925N.pdf /docs/en/data-sheet/MD8IC925N.pdf Data Sheet N 980000996212993340 2022-12-07 pdf N en Sep 8, 2016 980000996212993340 Data Sheet Y N MD8IC925N 728-960 MHz, 2.5 W Avg., 28 V Data Sheet アプリケーション・ノート Application Note 6 2 2 English This document explains the methodology used by NXP for thermal characterization of RF high power amplifier products, which include LDMOS and GaN active devices. 1075398872032723970051 PSP 235.5 KB None None documents None 1075398872032723970051 /docs/en/application-note/AN1955.pdf 235468 /docs/en/application-note/AN1955.pdf AN1955 documents N N 2016-11-09 Thermal Characterization Methodology of RF Power Amplifiers - Application Note /docs/en/application-note/AN1955.pdf /docs/en/application-note/AN1955.pdf Application Note N 645036621402383989 2025-01-28 pdf N en Jul 11, 2024 645036621402383989 Application Note Y N Thermal Characterization Methodology of RF Power Amplifiers - Application Note 3 0 English New family of wideband Doherty RFIC power amplifiers linearized with dual path adaptive predistortion device 1484618923296719623473 PSP 273.2 KB None None documents None 1484618923296719623473 /docs/en/application-note/AN5296-application-note.pdf 273244 /docs/en/application-note/AN5296-application-note.pdf AN5296 documents N N 2017-01-16 Effective Small Cell Solutions for MIMO Radios /docs/en/application-note/AN5296-application-note.pdf /docs/en/application-note/AN5296-application-note.pdf Application Note N 645036621402383989 2022-12-07 pdf N en Jan 15, 2017 645036621402383989 Application Note Y N Effective Small Cell Solutions for MIMO Radios 4 3 English I989356375600 PSP 910.7 KB None None documents None I989356375600 /docs/en/application-note/AN1907.pdf 910737 /docs/en/application-note/AN1907.pdf AN1907 documents N N 2016-11-09 AN1907 Solder Reflow Attach Method for High Power RF Devices in Over-Molded Plastic Packages /docs/en/application-note/AN1907.pdf /docs/en/application-note/AN1907.pdf Application Note N 645036621402383989 2025-01-28 pdf N en May 13, 2009 645036621402383989 Application Note Y N AN1907 Solder Reflow Attach Method for High Power RF Devices in Over-Molded Plastic Packages 5 0 English This application note provides NXP Semiconductors customers with a guide for mounting high power RF transistors and integrated circuits in Over-Molded Plastic (OMP) packages by clamping down the RF power device in the Power Amplifier (PA) housing. 1236894638615715664840 PSP 449.7 KB None None documents None 1236894638615715664840 /docs/en/application-note/AN3789.pdf 449688 /docs/en/application-note/AN3789.pdf AN3789 documents N N 2016-10-31 Clamping of High Power RF Transistors and RFICs in Over-Molded Plastic Packages /docs/en/application-note/AN3789.pdf /docs/en/application-note/AN3789.pdf Application Note N 645036621402383989 2024-03-13 pdf N en Mar 12, 2009 645036621402383989 Application Note Y N Clamping of High Power RF Transistors and RFICs in Over-Molded Plastic Packages 6 1 English This application note introduces a bias control circuit that can be used with the NXP<sup>&#174;</sup> family of RF integrated circuits. 1078170496490702478807 PSP 140.7 KB None None documents None 1078170496490702478807 /docs/en/application-note/AN1987.pdf 140747 /docs/en/application-note/AN1987.pdf AN1987 documents N N 2016-10-31 Quiescent Current Control for the RF Integrated Circuit Device Family - AN1987 /docs/en/application-note/AN1987.pdf /docs/en/application-note/AN1987.pdf Application Note N 645036621402383989 2024-03-13 pdf N en May 12, 2004 645036621402383989 Application Note Y N Quiescent Current Control for the RF Integrated Circuit Device Family - AN1987 7 0 English Using Quiescent Current Thermal Tracking Circuit in the RF Integrated Circuit to maintain constant quiescent current over a large temperature range. 1065730389394721762372 PSP 134.6 KB None None documents None 1065730389394721762372 /docs/en/application-note/AN1977.pdf 134579 /docs/en/application-note/AN1977.pdf AN1977 documents N N 2016-10-31 Quiescent Current Control for the RF Integrated Circuit Device Family - AN1977 /docs/en/application-note/AN1977.pdf /docs/en/application-note/AN1977.pdf Application Note N 645036621402383989 2024-03-13 pdf N en Oct 9, 2003 645036621402383989 Application Note Y N Quiescent Current Control for the RF Integrated Circuit Device Family - AN1977 パッケージ情報 Package Information 2 8 B English 98ASA10650D, 1618-02, 14 Lead TO-270 Wide Body 1128707279103707732108 PSP 72.7 KB None None documents None 1128707279103707732108 /docs/en/package-information/98ASA10650D.pdf 72681 /docs/en/package-information/98ASA10650D.pdf SOT1720-2 documents N N 2016-10-31 98ASA10650D, TO, 17.65x9.25x2.59, Pitch 0.36, 14 Pins /docs/en/package-information/98ASA10650D.pdf /docs/en/package-information/98ASA10650D.pdf Package Information N 302435339416912908 2022-12-07 pdf N en Mar 18, 2016 302435339416912908 Package Information D N 98ASA10650D, TO, 17.65x9.25x2.59, Pitch 0.36, 14 Pins 9 B English 98ASA10653D, 1621-02, 14 Lead TO-270 Wide Body Gull Wing 1128707281180741926906 PSP 77.4 KB None None documents None 1128707281180741926906 /docs/en/package-information/98ASA10653D.pdf 77443 /docs/en/package-information/98ASA10653D.pdf SOT1720-3 documents N N 2016-10-31 98ASA10653D, TO, 17.6x9.3x2.59, Pitch 1.02, 14 Pins /docs/en/package-information/98ASA10653D.pdf /docs/en/package-information/98ASA10653D.pdf Package Information N 302435339416912908 2022-12-07 pdf N en Feb 26, 2016 302435339416912908 Package Information D N 98ASA10653D, TO, 17.6x9.3x2.59, Pitch 1.02, 14 Pins ホワイト・ペーパ White Paper 1 10 0 English Improved performance in 2nd generation Airfast<sup>&#174;</sup> RFICS provide PA designers compact, cost-effective device solutions for next generation base stations. 1431960797038715181022 PSP 167.4 KB None None documents None 1431960797038715181022 /docs/en/white-paper/AIRFASTWBFWP.pdf 167378 /docs/en/white-paper/AIRFASTWBFWP.pdf AIRFASTWBFWP documents N N 2016-10-31 Advances in Airfast RFICs White Paper /docs/en/white-paper/AIRFASTWBFWP.pdf /docs/en/white-paper/AIRFASTWBFWP.pdf White Paper N 918633085541740938 2024-02-09 pdf N en May 15, 2015 918633085541740938 White Paper Y N Advances in Airfast RFICs White Paper false 0 MD8IC925N downloads ja true 1 Y PSP アプリケーション・ノート 6 /docs/en/application-note/AN1955.pdf 2016-11-09 1075398872032723970051 PSP 2 Jul 11, 2024 Application Note This document explains the methodology used by NXP for thermal characterization of RF high power amplifier products, which include LDMOS and GaN active devices. None /docs/en/application-note/AN1955.pdf English documents 235468 None 645036621402383989 2025-01-28 N /docs/en/application-note/AN1955.pdf Thermal Characterization Methodology of RF Power Amplifiers - Application Note /docs/en/application-note/AN1955.pdf documents 645036621402383989 Application Note N en None Y pdf 2 N N Thermal Characterization Methodology of RF Power Amplifiers - Application Note 235.5 KB AN1955 N 1075398872032723970051 /docs/en/application-note/AN5296-application-note.pdf 2017-01-16 1484618923296719623473 PSP 3 Jan 15, 2017 Application Note New family of wideband Doherty RFIC power amplifiers linearized with dual path adaptive predistortion device None /docs/en/application-note/AN5296-application-note.pdf English documents 273244 None 645036621402383989 2022-12-07 N /docs/en/application-note/AN5296-application-note.pdf Effective Small Cell Solutions for MIMO Radios /docs/en/application-note/AN5296-application-note.pdf documents 645036621402383989 Application Note N en None Y pdf 0 N N Effective Small Cell Solutions for MIMO Radios 273.2 KB AN5296 N 1484618923296719623473 /docs/en/application-note/AN1907.pdf 2016-11-09 I989356375600 PSP 4 May 13, 2009 Application Note None /docs/en/application-note/AN1907.pdf English documents 910737 None 645036621402383989 2025-01-28 N /docs/en/application-note/AN1907.pdf AN1907 Solder Reflow Attach Method for High Power RF Devices in Over-Molded Plastic Packages /docs/en/application-note/AN1907.pdf documents 645036621402383989 Application Note N en None Y pdf 3 N N AN1907 Solder Reflow Attach Method for High Power RF Devices in Over-Molded Plastic Packages 910.7 KB AN1907 N I989356375600 /docs/en/application-note/AN3789.pdf 2016-10-31 1236894638615715664840 PSP 5 Mar 12, 2009 Application Note This application note provides NXP Semiconductors customers with a guide for mounting high power RF transistors and integrated circuits in Over-Molded Plastic (OMP) packages by clamping down the RF power device in the Power Amplifier (PA) housing. None /docs/en/application-note/AN3789.pdf English documents 449688 None 645036621402383989 2024-03-13 N /docs/en/application-note/AN3789.pdf Clamping of High Power RF Transistors and RFICs in Over-Molded Plastic Packages /docs/en/application-note/AN3789.pdf documents 645036621402383989 Application Note N en None Y pdf 0 N N Clamping of High Power RF Transistors and RFICs in Over-Molded Plastic Packages 449.7 KB AN3789 N 1236894638615715664840 /docs/en/application-note/AN1987.pdf 2016-10-31 1078170496490702478807 PSP 6 May 12, 2004 Application Note This application note introduces a bias control circuit that can be used with the NXP<sup>&#174;</sup> family of RF integrated circuits. None /docs/en/application-note/AN1987.pdf English documents 140747 None 645036621402383989 2024-03-13 N /docs/en/application-note/AN1987.pdf Quiescent Current Control for the RF Integrated Circuit Device Family - AN1987 /docs/en/application-note/AN1987.pdf documents 645036621402383989 Application Note N en None Y pdf 1 N N Quiescent Current Control for the RF Integrated Circuit Device Family - AN1987 140.7 KB AN1987 N 1078170496490702478807 /docs/en/application-note/AN1977.pdf 2016-10-31 1065730389394721762372 PSP 7 Oct 9, 2003 Application Note Using Quiescent Current Thermal Tracking Circuit in the RF Integrated Circuit to maintain constant quiescent current over a large temperature range. None /docs/en/application-note/AN1977.pdf English documents 134579 None 645036621402383989 2024-03-13 N /docs/en/application-note/AN1977.pdf Quiescent Current Control for the RF Integrated Circuit Device Family - AN1977 /docs/en/application-note/AN1977.pdf documents 645036621402383989 Application Note N en None Y pdf 0 N N Quiescent Current Control for the RF Integrated Circuit Device Family - AN1977 134.6 KB AN1977 N 1065730389394721762372 データ・シート 1 /docs/en/data-sheet/MD8IC925N.pdf 2016-10-31 1369954385248726501985 PSP 1 Sep 8, 2016 Data Sheet The MD8IC925N wideband integrated circuit is designed with on-chip matching that makes it usable from 728 to 960 MHz. This multi-stage structure is rated for 24 to 32 volt operation and covers all typical cellular base station modulation formats. None /docs/en/data-sheet/MD8IC925N.pdf English documents 827049 None 980000996212993340 2022-12-07 N /docs/en/data-sheet/MD8IC925N.pdf MD8IC925N 728-960 MHz, 2.5 W Avg., 28 V Data Sheet /docs/en/data-sheet/MD8IC925N.pdf documents 980000996212993340 Data Sheet N en None Y pdf 1 N N MD8IC925N 728-960 MHz, 2.5 W Avg., 28 V Data Sheet 827.0 KB MD8IC925N N 1369954385248726501985 パッケージ情報 2 /docs/en/package-information/98ASA10650D.pdf 2016-10-31 1128707279103707732108 PSP 8 Mar 18, 2016 Package Information 98ASA10650D, 1618-02, 14 Lead TO-270 Wide Body None /docs/en/package-information/98ASA10650D.pdf English documents 72681 None 302435339416912908 2022-12-07 N /docs/en/package-information/98ASA10650D.pdf 98ASA10650D, TO, 17.65x9.25x2.59, Pitch 0.36, 14 Pins /docs/en/package-information/98ASA10650D.pdf documents 302435339416912908 Package Information N en None D pdf B N N 98ASA10650D, TO, 17.65x9.25x2.59, Pitch 0.36, 14 Pins 72.7 KB SOT1720-2 N 1128707279103707732108 /docs/en/package-information/98ASA10653D.pdf 2016-10-31 1128707281180741926906 PSP 9 Feb 26, 2016 Package Information 98ASA10653D, 1621-02, 14 Lead TO-270 Wide Body Gull Wing None /docs/en/package-information/98ASA10653D.pdf English documents 77443 None 302435339416912908 2022-12-07 N /docs/en/package-information/98ASA10653D.pdf 98ASA10653D, TO, 17.6x9.3x2.59, Pitch 1.02, 14 Pins /docs/en/package-information/98ASA10653D.pdf documents 302435339416912908 Package Information N en None D pdf B N N 98ASA10653D, TO, 17.6x9.3x2.59, Pitch 1.02, 14 Pins 77.4 KB SOT1720-3 N 1128707281180741926906 ホワイト・ペーパ 1 /docs/en/white-paper/AIRFASTWBFWP.pdf 2016-10-31 1431960797038715181022 PSP 10 May 15, 2015 White Paper Improved performance in 2nd generation Airfast<sup>&#174;</sup> RFICS provide PA designers compact, cost-effective device solutions for next generation base stations. None /docs/en/white-paper/AIRFASTWBFWP.pdf English documents 167378 None 918633085541740938 2024-02-09 N /docs/en/white-paper/AIRFASTWBFWP.pdf Advances in Airfast RFICs White Paper /docs/en/white-paper/AIRFASTWBFWP.pdf documents 918633085541740938 White Paper N en None Y pdf 0 N N Advances in Airfast RFICs White Paper 167.4 KB AIRFASTWBFWP N 1431960797038715181022 true Y Products

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