Features
Battery Cell Controller, Advanced, 6 Channels, TPL, LQFP48.
Package
HLQFP48 LQFP64, plastic, low profile quad flat package; 64 terminals; 0.5 mm pitch; 10 mm x 10 mm x 1.4 mm body.
購入オプション
MC8640TVJ1067NE
生産終了 (EOL)
12NC: 935315351557
詳細
注文
操作機能
| パラメータ | 値 |
|---|---|
Security Status | COMPANY PUBLIC |
Description | 32-Bit Power Architecture SoC, 1067MHz, DDR1/2, AltiVec, GbE, PCI-e, SRIO, -40 to 105C, Rev 3 |
| パラメータ | 値 |
|---|---|
Number of pins | 994 |
Package Style | CFBGA |
環境
| Part/12NC | 鉛フリー | EU RoHS | ハロゲンフリー | RHFインジケーター | 2次インターコネクト | REACH SVHC | Weight (mg) |
|---|---|---|---|---|---|---|---|
MC8640TVJ1067NE(935315351557) | Yes | Yes Certificate Of Analysis (CoA) | Yes |  | e2 | REACH SVHC | 5396.3 |
品質
| Part/12NC | 安全保障機能安全 | 吸湿感度レベル (MSL) | Peak Package Body Temperature (PPT) (C°) | Maximum Time at Peak Temperatures (s) | |||
|---|---|---|---|---|---|---|---|
| 鉛フリーはんだ | 鉛フリーはんだ | 鉛フリーはんだ | |||||
MC8640TVJ1067NE (935315351557) | No | 3 | 245 | 30 | |||
配送
| Part/12NC | 関税分類番号（米国)免責事項: | 輸出規制品目番号（米国） |
|---|---|---|
MC8640TVJ1067NE (935315351557) | 854231 | 3A991A1 |
製造終了品・代替品データ
| Part/12NC | 製造終了のお知らせ | 最終購入日 | 最終納品日 | 交換 |
|---|---|---|---|---|
MC8640TVJ1067NE (935315351557) | NOTICE | 2021-09-09 | 2022-09-09 | - |
製品変更のお知らせ
| Part/12NC | 発行日 | 有効期限 | PCN | タイトル |
|---|---|---|---|---|
MC8640TVJ1067NE (935315351557) | 2021-03-04 | 2021-03-05 | 202102034DN | Discontinuance of P1010P1020 P1022 P2020P3041 P4080 P5040 C290 MSC8156 BSC9131837x 8548 8572 8536 8544 Families |
MC8640TVJ1067NE (935315351557) | 2020-12-15 | 2020-12-16 | 202011011I | NXP Will Add a Sealed Date to the Product Label |
詳細 MPC8640
NXP’s MPC8640D dual-core processor is engineered to deliver breakthrough performance, connectivity and integration for embedded networking, telecom, aerospace and defense, storage, industrial and pervasive computing applications.
The MPC8640D’s strength is its integration of the high-performance e600 core built on Power Architecture® technology and combined with the PowerQUICC® system-on-chip (SoC) platform. With dual-core performance and integrated northbridge and southbridge functionality, this single chip replaces what could take up to four chips using other solutions. This translates into smaller boards or higher processing density. Additionally, all core-to-peripheral connections are internal in an integrated device, so the board designer is not exposed to the difficulties of laying out high-speed parallel buses.