MC8640VJ1250HE 製品情報|NXP

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MC8640VJ1250HE

生産終了 (EOL)

MC8640VJ1250HE

生産終了 (EOL)

購入オプション

MC8640VJ1250HE

生産終了 (EOL)

12NC: 935315503557

詳細

  • 梱包: TRAY-Tray, Bakeable, Multiple in Drypack
  • 最小パッケージ数量: 24
  • 最小注文数量: 24
  • リードタイム: 99 weeks

注文

置き換え部品

操作機能

パラメータ値
Security Status
COMPANY PUBLIC
Description
32-Bit Power Architecture SoC, 1250MHz, DDR1/2, AltiVec, GbE, PCI-e, SRIO,105C, Rev 3
パラメータ値
Number of pins
994
Package Style
CFBGA

環境

Part/12NC鉛フリーEU RoHSハロゲンフリーRHFインジケーター2次インターコネクトREACH SVHCWeight (mg)
MC8640VJ1250HE(935315503557)
Yes
Yes
Certificate Of Analysis (CoA)
Yes
D
e2
REACH SVHC
5396.3

品質

Part/12NC安全保障機能安全吸湿感度レベル (MSL)Peak Package Body Temperature (PPT) (C°)Maximum Time at Peak Temperatures (s)
鉛フリーはんだ鉛フリーはんだ鉛フリーはんだ
MC8640VJ1250HE
(935315503557)
No
3
245
30

配送

Part/12NC関税分類番号（米国)免責事項:輸出規制品目番号（米国）
MC8640VJ1250HE
(935315503557)
854231
3A991A1

製造終了品・代替品データ

Part/12NC製造終了のお知らせ最終購入日 最終納品日交換
MC8640VJ1250HE
(935315503557)
NOTICE
2021-09-09
2022-09-09
-

製品変更のお知らせ

Part/12NC発行日有効期限PCNタイトル
MC8640VJ1250HE
(935315503557)
2021-03-252021-03-26202102034DNU01Discontinuance of P1010P1020 P1022 P2020P3041 P4080 P5040 C290 MSC8156 BSC9131837x 8548 8572 8536 8544 Families
MC8640VJ1250HE
(935315503557)
2021-03-042021-03-05202102034DNDiscontinuance of P1010P1020 P1022 P2020P3041 P4080 P5040 C290 MSC8156 BSC9131837x 8548 8572 8536 8544 Families
MC8640VJ1250HE
(935315503557)
2020-12-152020-12-16202011011INXP Will Add a Sealed Date to the Product Label

詳細 MPC8640

NXP’s MPC8640D dual-core processor is engineered to deliver breakthrough performance, connectivity and integration for embedded networking, telecom, aerospace and defense, storage, industrial and pervasive computing applications.

The MPC8640D’s strength is its integration of the high-performance e600 core built on Power Architecture® technology and combined with the PowerQUICC® system-on-chip (SoC) platform. With dual-core performance and integrated northbridge and southbridge functionality, this single chip replaces what could take up to four chips using other solutions. This translates into smaller boards or higher processing density. Additionally, all core-to-peripheral connections are internal in an integrated device, so the board designer is not exposed to the difficulties of laying out high-speed parallel buses.