MCF5249VM140 製品情報|NXP

特徴


MCF5249 V2CORE 96KSRAM

パッケージ


BGA160: BGA160, plastic, ball grid array; 160 balls; 1 mm pitch; 15 mm x 15 mm x 1.18 mm body

購入オプション

MCF5249VM140

生産終了 (EOL)

12NC: 935309472557

詳細

注文

操作機能

パラメータ
Security Status
COMPANY PUBLIC
Description
MCF5249 V2CORE 96KSRAM
パラメータ
Number of pins
160
Package Style
BGA

環境

Part/12NC鉛フリーEU RoHSハロゲンフリーRHFインジケーター2次インターコネクトREACH SVHCWeight (mg)
MCF5249VM140(935309472557)
Yes
Yes
Certificate Of Analysis (CoA)
Yes
D
e1
REACH SVHC
585.8
SCF5249VM140(935309473557)
Yes
Yes
Certificate Of Analysis (CoA)
Yes
D
e1
REACH SVHC
585.8

品質

Part/12NC安全保障機能安全吸湿感度レベル (MSL)Peak Package Body Temperature (PPT) (C°)Maximum Time at Peak Temperatures (s)
鉛フリーはんだ鉛フリーはんだ鉛フリーはんだ
MCF5249VM140
(935309472557)
No
3
260
40
SCF5249VM140
(935309473557)
No
3
260
40

配送

Part/12NC関税分類番号(米国)免責事項:輸出規制品目番号(米国)
MCF5249VM140
(935309472557)
854231
3A991A2
SCF5249VM140
(935309473557)
854231
3A991A2

製造終了品・代替品データ

Part/12NC製造終了のお知らせ最終購入日 最終納品日交換
MCF5249VM140
(935309472557)
-
2013-02-23
2014-02-23
SCF5249VM140
(935309473557)

製品変更のお知らせ

Part/12NC発行日有効期限PCNタイトル
MCF5249VM140
(935309472557)
2020-12-152020-12-16202011011INXP Will Add a Sealed Date to the Product Label
SCF5249VM140
(935309473557)
SCF5249VM140
(935309473557)
2017-12-202018-01-03201710023INew PQ Label Input for Non-MPQ Shipments

詳細 MCF524X

The MCF5249 microprocessor delivers a high level of performance for the popular ColdFire® V2 core with over 125 (Dhrystone 2.1) MIPS @ 140 MHz and the lowest power consumption (1.3 mW/MHz) on a ColdFire device. This highly integrated microprocessor builds upon the ColdFire peripheral mix by adding audio enhancements and analog functionality in addition to an enhanced multiplier-accumulator unit (eMAC), large on-chip memory (96 KB SRAM, 8 KB I-Cache) and a SDRAM controller. The device is ideal for applications requiring significant control processing for file management, data buffering and user interface, as well as signal processing in key markets such as security, gaming, medical and digital audio. This leading package of integration, high performance and low power consumption allows fast time to market through access to high quality software modules, easy code reuse and extensive third-party tool support.