MCF54452VR266 製品情報|NXP

特徴


MCF5445x 32-bit MPU, ColdFire V4 core, 266MHz, PBGA 360

パッケージ


BGA360: BGA360, plastic, ball grid array; 360 balls; 1 mm pitch; 23 mm x 23 mm x 1.9 mm body

購入オプション

MCF54452VR266

生産終了 (EOL)

12NC: 935313924557

詳細

注文

MCF54452VR266R

生産終了 (EOL)

12NC: 935313924518

詳細

注文

操作機能

パラメータ
Operating Frequency [Max] (MHz)
266
RAM (kB)
32
パラメータ
GPIO
132
Ambient Operating Temperature (Min to Max) (℃)
0 to 70

環境

Part/12NC鉛フリーEU RoHSハロゲンフリーRHFインジケーター2次インターコネクトREACH SVHCWeight (mg)
MCF54452VR266(935313924557)
Yes
Yes
Certificate Of Analysis (CoA)
Yes
D
e2
REACH SVHC
1733.3
MCF54452VR266R(935313924518)
Yes
Yes
Certificate Of Analysis (CoA)
Yes
D
e2
REACH SVHC
1733.3

品質

Part/12NC安全保障機能安全吸湿感度レベル (MSL)Peak Package Body Temperature (PPT) (C°)Maximum Time at Peak Temperatures (s)
鉛フリーはんだ鉛フリーはんだ鉛フリーはんだ
MCF54452VR266
(935313924557)
No
3
260
40
MCF54452VR266R
(935313924518)
No
3
260
40

配送

Part/12NC関税分類番号(米国)免責事項:輸出規制品目番号(米国)
MCF54452VR266
(935313924557)
854231
3A991A2
MCF54452VR266R
(935313924518)
854231
3A991A2

製造終了品・代替品データ

Part/12NC製造終了のお知らせ最終購入日 最終納品日交換
MCF54452VR266
(935313924557)
NOTICE
2021-05-14
2021-12-31
MCF54452VP266
(935420986557)
MCF54452VR266R
(935313924518)
NOTICE
2021-05-14
2021-12-31
MCF54452VP266R
(935420986518)

製品変更のお知らせ

Part/12NC発行日有効期限PCNタイトル
MCF54452VR266
(935313924557)
2021-04-242021-04-25202103047DNMCF5445X PBGA Part Number Migration due to Molding Change from Corner-Gate Mold (CGM) to Pin-Gate Mold (PGM)
MCF54452VR266R
(935313924518)
MCF54452VR266
(935313924557)
2020-12-152020-12-16202011011INXP Will Add a Sealed Date to the Product Label
MCF54452VR266R
(935313924518)

詳細 MCF5445X

The MCF5445x family of 32-bit microprocessors feature a rich set of connectivity peripherals including Ethernet, USB on-the-go (USB OTG) and peripheral component interconnect (PCI).

Developed for power-conscious designers, the MCF5445x family is ideal for consumer and embedded control designs that need high-performance and connectivity.

These highly integrated microprocessors open the door to expanding application capabilities while driving down total system cost and power requirements.