Features
Battery Cell Controller, Advanced, 6 Channels, TPL, LQFP48.
Package
HLQFP48 LQFP64, plastic, low profile quad flat package; 64 terminals; 0.5 mm pitch; 10 mm x 10 mm x 1.4 mm body.
Battery Cell Controller, Advanced, 6 Channels, TPL, LQFP48.
HLQFP48 LQFP64, plastic, low profile quad flat package; 64 terminals; 0.5 mm pitch; 10 mm x 10 mm x 1.4 mm body.
SSOP32: SSOP32; plastic, shrink small outline package; 32 terminals; 0.65 mm pitch; 11 mm x 7.5 mm x 2.3 mm body
12NC: 935333165574
詳細
注文
12NC: 935333165518
詳細
注文
パラメータ | 値 |
---|---|
Device Function | comm transceivers, linear regulators, system basis chip |
Data Rate (Max) (Kbps) | 1000.0 |
Supply Voltage [min] (V) | 5.5 |
パラメータ | 値 |
---|---|
Supply Voltage [max] (V) | 28 |
Interface and Input Control | SPI / SPI |
Ambient Operating Temperature (Min to Max) (℃) | -40 to 125 |
Part/12NC | 鉛フリー | EU RoHS | ハロゲンフリー | RHFインジケーター | 2次インターコネクト | REACH SVHC | Weight (mg) |
---|---|---|---|---|---|---|---|
MCZ33903DD5EK(935333165574) | Yes | Yes Certificate Of Analysis (CoA) | Yes | e3 | REACH SVHC | 472.0 | |
MCZ33903DD5EKR2(935333165518) | Yes | Yes Certificate Of Analysis (CoA) | Yes | e3 | REACH SVHC | 472.0 |
Part/12NC | 安全保障機能安全 | 吸湿感度レベル (MSL) | Peak Package Body Temperature (PPT) (C°) | Maximum Time at Peak Temperatures (s) | |||
---|---|---|---|---|---|---|---|
鉛フリーはんだ | 鉛フリーはんだ | 鉛フリーはんだ | |||||
MCZ33903DD5EK (935333165574) | No | 3 | 260 | 40 | |||
MCZ33903DD5EKR2 (935333165518) | No | 3 | 260 | 40 |
Part/12NC | 関税分類番号(米国)免責事項: |
---|---|
MCZ33903DD5EK (935333165574) | 854239 |
MCZ33903DD5EKR2 (935333165518) | 854239 |
Part/12NC | 発行日 | 有効期限 | PCN | タイトル |
---|---|---|---|---|
MCZ33903DD5EK (935333165574) | 2020-12-15 | 2020-12-16 | 202011011I | NXP Will Add a Sealed Date to the Product Label |
MCZ33903DD5EKR2 (935333165518) | ||||
MCZ33903DD5EKR2 (935333165518) | 2017-12-20 | 2018-01-03 | 201710023I | New PQ Label Input for Non-MPQ Shipments |
The NXP MC33903 is part of a second generation family of system basis chips, combining multiple features and enhanced module design.