MC33662 | LIN 2.1 / SAEJ2602-2, LIN Physical Layer | NXP Semiconductors

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LIN 2.1 / SAEJ2602-2, LIN Physical Layer

MC33662 アクティブ

The NXP MC33662 is a physical layer component dedicated to automotive LIN sub-bus applications.

  • Designed to support automotive networks with Controller Area Network (CAN)
  • Part number selection defines the operating baud rate (33662L or 33662S for 20 kB/s and 33662J for 10 kB/s)
  • Both integrate a fast baud rate (100 kB/s) for test and programming modes
  • Provides excellent Electromagnetic Compatibility (EMC) and Radiated Emission performance, Electrostatic Discharge (ESD) robustness and safe behaviour in case of TXD short to ground

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ブロック図

MC33662

NXP<sup>&#174;</sup> MC33662 Internal Block Diagram
図を取得する PDF

Features

Key Features

  • Operational from a VSUP of 7.0 to 18 V DC, functional up to 27 V DC, and handles 40 V during Load Dump
  • Compatible with LIN Protocol Specification 1.3, 2.0, 2.1, and SAEJ2602-2
  • Active bus wave shaping, offering excellent radiated emission performance
  • Sustains up to 15.0 kV minimum ESD IEC61000-4-2 on the LIN Bus, 20 kV on the WAKE pin, and 25 kV on the VSUP pin
  • Very high immunity against electromagnetic interference
  • Low standby current in Sleep mode
  • Over-temperature protection
  • Local and remote Wake-up capability reported by the RXD pin
  • Fast baud rate selection reported by RXD pin
  • 5.0 V and 3.3 V compatible digital inputs without any required external components

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N true 0 PSPMC33662ja 4 アプリケーション・ノート Application Note t789 2 データ・シート Data Sheet t520 1 ユーザ・ガイド User Guide t792 1 ja 2 1 3.0 English This application note provides guidelines for handling and assembly of SOIC package during Printed Circuit Board (PCB) assembly. 10jsBvfc PSP 3.5 MB None None documents None 10jsBvfc /docs/en/application-note/AN2409.pdf 3536520 /docs/en/application-note/AN2409.pdf AN2409 N N 2016-10-31 AN2409, Small Outline Integrated Circuit (SOIC) Package - Application Note /docs/en/application-note/AN2409.pdf /docs/en/application-note/AN2409.pdf Application Note N Y 645036621402383989 2024-01-19 pdf N en Oct 21, 2014 Application Note t789 アプリケーション・ノート Application Note Y N AN2409, Small Outline Integrated Circuit (SOIC) Package - Application Note 2 MC33662BJEF,MC33662BLEF,MC33662BSEF 8.0 English The Local Interconnect Network (LIN) is a serial communication protocol, designed to support automotive networks in conjunction with a Controller Area Network (CAN). As the lowest level of a hierarchical network, LIN enables cost-effective communication with sensors and actuators when all the features of CAN are not required. 1314652107281711397941 PSP 774.4 KB None None documents None 1314652107281711397941 /docs/en/data-sheet/MC33662.pdf 774445 /docs/en/data-sheet/MC33662.pdf MC33662 N N 2019-04-23 MC33662, LIN 2.1 / SAEJ2602-2, LIN Physical Layer - Data Sheet /docs/en/data-sheet/MC33662.pdf /docs/en/data-sheet/MC33662.pdf Data Sheet N Y 980000996212993340 2022-12-07 pdf N en Dec 18, 2018 Data Sheet t520 データ・シート Data Sheet Y N MC33662, LIN 2.1 / SAEJ2602-2, LIN Physical Layer - Data Sheet true ja ja アプリケーション・ノート Application Note 1 3 1.0 English The MC33781 and MC33784 together constitute NXP Semiconductors's implementation of the Distributed System Interface (DSI) Bus Standard, Version 2.02. 1225311007711718167766 PSP 1.0 MB None None documents None 1225311007711718167766 /docs/en/application-note/AN3670.pdf 1013814 /docs/en/application-note/AN3670.pdf AN3670 documents N N 2016-10-31 AN3670, Implementing a DSI Network Using the MC33781 and the MC33784 /docs/en/application-note/AN3670.pdf /docs/en/application-note/AN3670.pdf Application Note N 645036621402383989 2024-01-19 pdf N en Oct 29, 2008 645036621402383989 Application Note Y N AN3670, Implementing a DSI Network Using the MC33781 and the MC33784 ユーザ・ガイド User Guide 1 4 1.0 English This Evaluation Board is supplied for preliminary evaluation purposes. This kit is populated with a production device, and gives to you the opportunity to test the device in various configuration cases to quickly evaluate these features. 1314811926049711128730 PSP 1.0 MB None None documents None 1314811926049711128730 /docs/en/user-guide/KT33662UG.pdf 1025055 /docs/en/user-guide/KT33662UG.pdf KT33662UG documents N N 2011-08-31 KIT33662JEFEVBE, KIT33662LEFEVBE, Evaluation Board - User Guide /docs/en/user-guide/KT33662UG.pdf /docs/en/user-guide/KT33662UG.pdf User Guide N 132339537837198660 2023-06-19 pdf N en Aug 31, 2011 132339537837198660 User Guide Y N KIT33662JEFEVBE, KIT33662LEFEVBE, Evaluation Board - User Guide false 0 MC33662 downloads ja true 1 Y PSP Y Y アプリケーション・ノート 2 /docs/en/application-note/AN3670.pdf 2016-10-31 1225311007711718167766 PSP 3 Oct 29, 2008 Application Note The MC33781 and MC33784 together constitute NXP Semiconductors's implementation of the Distributed System Interface (DSI) Bus Standard, Version 2.02. None /docs/en/application-note/AN3670.pdf English documents 1013814 None 645036621402383989 2024-01-19 N /docs/en/application-note/AN3670.pdf AN3670, Implementing a DSI Network Using the MC33781 and the MC33784 /docs/en/application-note/AN3670.pdf documents 645036621402383989 Application Note N en None Y pdf 1.0 N N AN3670, Implementing a DSI Network Using the MC33781 and the MC33784 1.0 MB AN3670 N 1225311007711718167766 /docs/en/application-note/AN2409.pdf 2016-10-31 10jsBvfc PSP 1 Oct 21, 2014 Application Note アプリケーション・ノート This application note provides guidelines for handling and assembly of SOIC package during Printed Circuit Board (PCB) assembly. None /docs/en/application-note/AN2409.pdf English 3536520 None Application Note 2024-01-19 N /docs/en/application-note/AN2409.pdf AN2409, Small Outline Integrated Circuit (SOIC) Package - Application Note /docs/en/application-note/AN2409.pdf documents 645036621402383989 Application Note N Y en None Y t789 pdf 3.0 N N AN2409, Small Outline Integrated Circuit (SOIC) Package - Application Note 3.5 MB AN2409 N 10jsBvfc データ・シート 1 /docs/en/data-sheet/MC33662.pdf 2019-04-23 1314652107281711397941 PSP 2 Dec 18, 2018 Data Sheet データ・シート The Local Interconnect Network (LIN) is a serial communication protocol, designed to support automotive networks in conjunction with a Controller Area Network (CAN). As the lowest level of a hierarchical network, LIN enables cost-effective communication with sensors and actuators when all the features of CAN are not required. None /docs/en/data-sheet/MC33662.pdf English 774445 None Data Sheet 2022-12-07 N /docs/en/data-sheet/MC33662.pdf MC33662, LIN 2.1 / SAEJ2602-2, LIN Physical Layer - Data Sheet /docs/en/data-sheet/MC33662.pdf documents 980000996212993340 Data Sheet N Y en None Y t520 pdf 8.0 N N MC33662, LIN 2.1 / SAEJ2602-2, LIN Physical Layer - Data Sheet 774.4 KB MC33662BJEF,MC33662BLEF,MC33662BSEF MC33662 N 1314652107281711397941 ユーザ・ガイド 1 /docs/en/user-guide/KT33662UG.pdf 2011-08-31 1314811926049711128730 PSP 4 Aug 31, 2011 User Guide This Evaluation Board is supplied for preliminary evaluation purposes. This kit is populated with a production device, and gives to you the opportunity to test the device in various configuration cases to quickly evaluate these features. None /docs/en/user-guide/KT33662UG.pdf English documents 1025055 None 132339537837198660 2023-06-19 N /docs/en/user-guide/KT33662UG.pdf KIT33662JEFEVBE, KIT33662LEFEVBE, Evaluation Board - User Guide /docs/en/user-guide/KT33662UG.pdf documents 132339537837198660 User Guide N en None Y pdf 1.0 N N KIT33662JEFEVBE, KIT33662LEFEVBE, Evaluation Board - User Guide 1.0 MB KT33662UG N 1314811926049711128730 true Y Products

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