デザイン・ファイル
完全な内訳を受け取ります。 製品の設置面積などについては、 eCad ファイル.
LIN 2.1 / SAEJ2602-2, LIN Physical Layer
The NXP® MC33662 is a physical layer component dedicated to automotive LIN sub-bus applications.
- Designed to support automotive networks with Controller Area Network (CAN)
- Part number selection defines the operating baud rate (33662L or 33662S for 20 kB/s and 33662J for 10 kB/s)
- Both integrate a fast baud rate (100 kB/s) for test and programming modes
- Provides excellent Electromagnetic Compatibility (EMC) and Radiated Emission performance, Electrostatic Discharge (ESD) robustness and safe behaviour in case of TXD short to ground
MC33662_IMG
製品詳細
Features
Key Features
- Operational from a VSUP of 7.0 to 18 V DC, functional up to 27 V DC, and handles 40 V during Load Dump
- Compatible with LIN Protocol Specification 1.3, 2.0, 2.1, and SAEJ2602-2
- Active bus wave shaping, offering excellent radiated emission performance
- Sustains up to 15.0 kV minimum ESD IEC61000-4-2 on the LIN Bus, 20 kV on the WAKE pin, and 25 kV on the VSUP pin
- Very high immunity against electromagnetic interference
- Low standby current in Sleep mode
- Over-temperature protection
- Local and remote Wake-up capability reported by the RXD pin
- Fast baud rate selection reported by RXD pin
- 5.0 V and 3.3 V compatible digital inputs without any required external components
Product Longevity Program
- This product is included in the NXP Product Longevity Program ensuring a stable supply of products for your embedded designs. The MC33662 is included in the 15-year program
購入/パラメータ
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設計・リソース
ハードウェア
クイック・リファレンス
ボードタイプ.
1-5 の 10 ハードウェア提供
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評価・開発ボード
MC33662J LIN Physical Layer Evaluation Kit注目
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完全なソリューションKEA128 Green Automotive Networking
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完全なソリューションMPC5775B BMS and VCU Reference Design
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