SPC5674FAMVR3 製品情報|NXP

購入オプション

操作機能

パラメータ
Flash (kB)
4096
RAM (kB)
256
Core Type
e200
Core: Number of cores (SPEC)
1
Operating Frequency [Max] (MHz)
270
CAN
4
パラメータ
SCI
3
DSPI
4
Ambient Operating Temperature (Min to Max) (℃)
-40 to 125
Supply Voltage [min] (V)
4.5
Supply Voltage [max] (V)
5.5

環境

Part/12NC鉛フリーEU RoHSハロゲンフリーRHFインジケーター2次インターコネクトREACH SVHCWeight (mg)
SPC5674FAMVR3(935315691557)
Yes
Yes
Certificate Of Analysis (CoA)
Yes
D
e2
REACH SVHC
3420.55
SPC5674FAMVR3R(935315691518)
Yes
Yes
Certificate Of Analysis (CoA)
Yes
D
e2
REACH SVHC
3420.55

品質

Part/12NC安全保障機能安全吸湿感度レベル (MSL)Peak Package Body Temperature (PPT) (C°)Maximum Time at Peak Temperatures (s)
鉛フリーはんだ鉛フリーはんだ鉛フリーはんだ
SPC5674FAMVR3
(935315691557)
No
3
260
40
SPC5674FAMVR3R
(935315691518)
No
3
260
40

配送

Part/12NC関税分類番号(米国)免責事項:輸出規制品目番号(米国)
SPC5674FAMVR3
(935315691557)
854231
3A991A2
SPC5674FAMVR3R
(935315691518)
854231
3A991A2

製品変更のお知らせ

Part/12NC発行日有効期限PCNタイトル
SPC5674FAMVR3
(935315691557)
2022-11-192022-11-20202209016IMPC574xR Mask 1N83M MPC5676R Mask 3N23A MPC5777C Mask 2N45H and 3N45H MPC567xF Mask 0N31E and 3M17W Errata Update SEP2022
SPC5674FAMVR3R
(935315691518)
SPC5674FAMVR3
(935315691557)
2022-03-232022-03-24202202031IMPC567xF Mask 0N31E & 3M17W Errata List Update February 2022
SPC5674FAMVR3R
(935315691518)
SPC5674FAMVR3
(935315691557)
2020-12-152020-12-16202011011INXP Will Add a Sealed Date to the Product Label
SPC5674FAMVR3R
(935315691518)

詳細 MPC5674F

NXP<sup>®</sup> product built on Power Architecture technology

The MPC5674F

Power Architecture® MCU helps automakers offer more fuel-efficient automobiles and meet stricter government-mandated emissions standards by enabling precise control of engine events without sacrificing performance.

  • Addresses the growing computational demands of green engine designs
  • Designed to reduce time to market at lower costs and with higher reliability
  • Precisely controls fuel delivery and improves gas mileage
  • Performs knock detection without additional external components
  • Condenses code footprint by up to 30% for improved density and reduced memory requirements
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