Features
Battery Cell Controller, Advanced, 6 Channels, TPL, LQFP48.
Package
HLQFP48 LQFP64, plastic, low profile quad flat package; 64 terminals; 0.5 mm pitch; 10 mm x 10 mm x 1.4 mm body.
パッケージ
SO28: SO28, plastic, small outline package; 28 terminals; 1.27 mm pitch; 7.5 mm x 17.93 mm x 2.35 mm body
購入オプション
MC9S08SE8VWL
アクティブ
12NC: 935321432574
詳細
注文
MC9S08SE8VWLR
アクティブ
12NC: 935321432518
詳細
注文
操作機能
| パラメータ | 値 |
|---|---|
Flash (kB) | 8 |
RAM (kB) | 0.512 |
Core Type | S08 |
Operating Frequency [Max] (MHz) | 10 |
Bus Frequency (typ) (MHz) | 10 |
| パラメータ | 値 |
|---|---|
Supply Voltage [min] (V) | 2.7 |
Supply Voltage [max] (V) | 5.5 |
GPIO | 24 |
Ambient Operating Temperature (Min to Max) (℃) | -40 to 85 |
環境
| Part/12NC | 鉛フリー | EU RoHS | ハロゲンフリー | RHFインジケーター | 2次インターコネクト | REACH SVHC | Weight (mg) |
|---|---|---|---|---|---|---|---|
MC9S08SE8VWL(935321432574) | Yes | Yes Certificate Of Analysis (CoA) | Yes |  | e3 | REACH SVHC | 756.25 |
MC9S08SE8VWLR(935321432518) | Yes | Yes Certificate Of Analysis (CoA) | Yes | | e3 | REACH SVHC | 756.25 |
品質
| Part/12NC | 安全保障機能安全 | 吸湿感度レベル (MSL) | Peak Package Body Temperature (PPT) (C°) | Maximum Time at Peak Temperatures (s) | |||
|---|---|---|---|---|---|---|---|
| 鉛フリーはんだ | 鉛フリーはんだ | 鉛フリーはんだ | |||||
MC9S08SE8VWL (935321432574) | No | 3 | 260 | 40 | |||
MC9S08SE8VWLR (935321432518) | No | 3 | 260 | 40 | |||
配送
| Part/12NC | 関税分類番号（米国)免責事項: |
|---|---|
MC9S08SE8VWL (935321432574) | 854231 |
MC9S08SE8VWLR (935321432518) | 854231 |
製品変更のお知らせ
| Part/12NC | 発行日 | 有効期限 | PCN | タイトル |
|---|---|---|---|---|
MC9S08SE8VWL (935321432574) | 2020-12-15 | 2020-12-16 | 202011011I | NXP Will Add a Sealed Date to the Product Label |
MC9S08SE8VWLR (935321432518) | ||||
MC9S08SE8VWL (935321432574) | 2017-12-20 | 2018-01-03 | 201710023I | New PQ Label Input for Non-MPQ Shipments |
MC9S08SE8VWLR (935321432518) |
詳細 S08SE
The MC9S08SE8 series MCUs are members of the cost-effective, high-performance S08 family of 8-bit microcontroller units (MCUs). All MCUs in the family use the enhanced S08 core and are available with a variety of modules, memory sizes, memory and package types.