MCIMX233CJM4C 製品情報|NXP

特徴


Huashan TA5 ROM 169BGA - Industrial

パッケージ


LFBGA169: LFBGA169, plastic, low profile fine-pitch ball grid array; 169 balls; 0.8 mm pitch; 11 mm x 11 mm x 1.02 mm body

購入オプション

MCIMX233CJM4C

アクティブ

12NC: 935314408557

詳細

注文

代理店からの注文

MCIMX233CJM4CR2

アクティブ

12NC: 935314408518

詳細

注文

代理店からの注文

操作機能

パラメータ
Core Type
1 x Arm9
Operating Frequency [Max] (MHz)
454
Serial Communication
1 x I²C, 1 x SPI, 3 x UART

環境

Part/12NC鉛フリーEU RoHSハロゲンフリーRHFインジケーター2次インターコネクトREACH SVHCWeight (mg)
MCIMX233CJM4C(935314408557)
Yes
Yes
Certificate Of Analysis (CoA)
Yes
D
e1
REACH SVHC
280.4
MCIMX233CJM4CR2(935314408518)
Yes
Yes
Certificate Of Analysis (CoA)
Yes
D
e1
REACH SVHC
280.4

品質

Part/12NC安全保障機能安全吸湿感度レベル (MSL)Peak Package Body Temperature (PPT) (C°)Maximum Time at Peak Temperatures (s)
鉛フリーはんだ鉛フリーはんだ鉛フリーはんだ
MCIMX233CJM4C
(935314408557)
No
3
260
40
MCIMX233CJM4CR2
(935314408518)
No
3
260
40

配送

Part/12NC関税分類番号(米国)免責事項:輸出規制品目番号(米国)
MCIMX233CJM4C
(935314408557)
854231
5A992C
MCIMX233CJM4CR2
(935314408518)
854231
5A992C

製品変更のお知らせ

Part/12NC発行日有効期限PCNタイトル
MCIMX233CJM4C
(935314408557)
2020-12-152020-12-16202011011INXP Will Add a Sealed Date to the Product Label
MCIMX233CJM4CR2
(935314408518)

詳細 i.MX233

The i.MX233 applications processor provides ample headroom for consumer and embedded applications without sacrificing battery life.

  • Allows customers to eliminate external components, reducing overall system bill of materials cost
  • Integrates advanced power management technology to manage the power sequencing required by the processor itself
  • Offers low power consumption that can improve energy efficiency
  • Backed by strong enablement for designing differentiated products in less time