Features
Battery Cell Controller, Advanced, 6 Channels, TPL, LQFP48.
Package
HLQFP48 LQFP64, plastic, low profile quad flat package; 64 terminals; 0.5 mm pitch; 10 mm x 10 mm x 1.4 mm body.
パッケージ
LFBGA400: LFBGA400, plastic, low profile fine-pitch ball grid array; 400 balls; 0.8 mm pitch; 17 mm x 17 mm x 1.18 mm body
購入オプション
MCIMX251AJM4A
アクティブ
12NC: 935311276557
詳細
注文
MCIMX251AJM4AR2
アクティブ
12NC: 935311276518
詳細
注文
操作機能
| パラメータ | 値 |
|---|---|
Core Type | 1 x Arm9 |
Operating Frequency [Max] (MHz) | 400 |
Serial Communication | 1 x I²C, 1 x SPI, 1 x UART |
| パラメータ | 値 |
|---|---|
CAN | 1 |
Ethernet | 1 x 10/100 BaseT, 1 x MII |
環境
| Part/12NC | 鉛フリー | EU RoHS | ハロゲンフリー | RHFインジケーター | 2次インターコネクト | REACH SVHC | Weight (mg) |
|---|---|---|---|---|---|---|---|
MCIMX251AJM4A(935311276557) | Yes | Yes Certificate Of Analysis (CoA) | Yes |  | e1 | REACH SVHC | 838.7 |
MCIMX251AJM4AR2(935311276518) | Yes | Yes Certificate Of Analysis (CoA) | Yes | | e1 | REACH SVHC | 838.7 |
品質
| Part/12NC | 安全保障機能安全 | 吸湿感度レベル (MSL) | Peak Package Body Temperature (PPT) (C°) | Maximum Time at Peak Temperatures (s) | |||
|---|---|---|---|---|---|---|---|
| 鉛フリーはんだ | 鉛フリーはんだ | 鉛フリーはんだ | |||||
MCIMX251AJM4A (935311276557) | No | 3 | 260 | 40 | |||
MCIMX251AJM4AR2 (935311276518) | No | 3 | 260 | 40 | |||
配送
| Part/12NC | 関税分類番号（米国)免責事項: | 輸出規制品目番号（米国） | CCATS |
|---|---|---|---|
MCIMX251AJM4A (935311276557) | 854231 | 5A992C | G168372 |
MCIMX251AJM4AR2 (935311276518) | 854231 | 5A992C | G168372 |
製品変更のお知らせ
| Part/12NC | 発行日 | 有効期限 | PCN | タイトル |
|---|---|---|---|---|
MCIMX251AJM4A (935311276557) | 2020-12-15 | 2020-12-16 | 202011011I | NXP Will Add a Sealed Date to the Product Label |
MCIMX251AJM4AR2 (935311276518) | ||||
MCIMX251AJM4A (935311276557) | 2017-12-20 | 2018-01-03 | 201710023I | New PQ Label Input for Non-MPQ Shipments |
詳細 i.MX251
The Arm9™-based i.MX251 applications processor is for cost sensitive automotive applications. The Arm926EJ-S™ CPU can run at speeds up to 400MHz giving enough headroom for entry level automotive applications while minimizing power consumption. Integration of two USB PHYs, a 12-bit ADC, low cost DDR2, MMC/SD/SDIO, 10/100 Ethernet with RMII, and on-chip SRAM reduces the Bill of Material (BOM) costs for price-sensitive applications.
The i.MX251 has the ability to connect with many different peripherals like Wi-Fi through SDIO or USB and Bluetooth via UART or SSI/I2S. With Enhanced Serial Audio Interface (ESAI) and CAN connectivity the i.MX251 is a cost effective solution targeted for audio connectivity.