Layerscape® 1043A and 1023A Processors
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Layerscape® Access LA9310 Programmable Baseband Processor
The Layerscape® Access LA9310 programmable baseband processor is a digital signal processor with integrated data converters (ADC/DAC) for physical layer processing of 5G infrastructure, DFE, and custom communication systems at the network edge. Its low cost and power and programmable signal processing capabilities make it an attractive option to expensive FPGAs in applications such as network listening, small-scale radio units and repeaters.
The ADC / DAC supports a zero-IF I/Q interface to an RFIC suitable for both sub-6GHz and limited bandwidth mmWave applications. NXP’s VSPA DSP implements sample-level baseband processing in the digital domain, enabling a flexible software defined radio.
製品詳細
Features
Core and Memory Complex
- One VSPA generation 2, 16AU DSP at up to 614MHz (~80 GFLOP)
- One M4 32b Arm® core at up to 307MHz
Connectivity and I/O
- One PCIe Gen3 lane
- Five {I+Q} ADCs, each sampling at up to 153M samples per second
- One {I+Q} DAC, sampling at up to 153M samples per second
Acceleration
- Forward error correction for proprietary communication protocols
- DMA for internal and host side data movement
Low speed I/O and RFIC control
- General purpose single lane SPI with four Chip Selects
- Lightweight LVDS Communication Protocol for RFIC Interface
- I²C controller
- UART
- JTAG
Device
- 8mm x 8mm package
- 1.5W total max power at 105C
Usage Information
The ADC / DAC analog subsystem supports a zero-IF I/Q interface toward an RFIC. With a sample rate of up to 153M samples per second, is suitable for both sub-6GHz and limited bandwidth mmWave applications. The Vector Signal Processing Accelerator (VSPA) DSP leverages NXP supplied software libraries to efficiently implement sample-level baseband processing in the digital domain (that is, digital up/down conversion, digital filtering, et cetera), enabling a flexible software defined radio for standard and proprietary protocols. Results are provided to the host, typically an LS1023A or LS1043A, over a x1 Gen3 PCIe interface. The device includes DMA engines, timing blocks and RF control interfaces such as I²C, SPI and proprietary LLCP signaling.
In addition, the LA9310 is intended for use in industrial and measurement use-cases. For such applications, the LA9310 functions as a lookaside accelerator to a host processor such as the i.MX family of devices, functioning as a signal preprocessor that includes analog sample acquisition together with initial DSP (filter/data reduction) processing, or as a math accelerator. In these use-cases, the lookaside accelerator often replaces an FPGA, connecting over PCIe or Ethernet.
Software Support
NXP provides a BSP for the LA9310 that includes drivers for all chip capabilities, example hello-world application that exercise the full data path of the device, VSPA libraries and FreeRTOS running on the M4 core. Reference code for target applications is available.
CodeWarrior for VSPA enables users to compile and debug VSPA code.
Hardware Tools
The LA9310 Reference Design Kit is a standalone system that consists of an LA9310 daughter card plugged into an LS1043A Reference Design Board. Customers can copy its design, use it to evaluate performance, and use it to debug their own hardware.
関連製品
Layerscape® Access LA12xx プログラマブル・ベースバンド・プロセッサ
購入/パラメータ
2 結果
マッチしていない 0 NRND
パーツ | 注文 | コンピュータ支援設計 モデル | Silicon Rev | ファミリー | 状況 | 開発ツール | 製品認証 | 標準価格 | パッケージ端子数 | パッケージタイプ | Package Pitch (mm) | コア・タイプ | コア：コア数 - 仕様 | 動作周波数[最大](MHz) | Typical Power | L2 Cache (Max) (KB) | SRAM (kB) | SPI | UART | I2C | PCIe | PCIe version | Watchdog timer | タイマー | デバッグ & トレース | Junction Temperature (Min to Max) (℃) |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Rev A0 | LS Access | アクティブ | LA9310RDK | Industrial | — | 157 | LFBGA157 | 0.5 | Arm Cortex-M4 | 1 | 307 | 1 | 0 | 66 | 1 | 1 | 1 | 1 | PCIe 3.0 | Y | 1 | JTAG | 0 to 105 | |||
Rev A0 | LS Access | アクティブ | LA9310RDK | Industrial | 100 @ US$19.19 | 157 | LFBGA157 | 0.5 | Arm Cortex-M4 | 1 | 307 | 1 | 0 | 66 | 1 | 1 | 1 | 1 | PCIe 3.0 | Y | 1 | JTAG | 0 to 105 |
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1-5 / 6 ドキュメント
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アプリケーション・ノート
Thermal Management Unit Usage
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アプリケーション・ノート
General soldering Temperature Process Guidelines
1-5 の 6 ドキュメント
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アプリケーション・ノート
Thermal Management Unit Usage
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アプリケーション・ノート
General soldering Temperature Process Guidelines
設計・リソース
