LA9310 Programmable Baseband Processor | NXP Semiconductors

Layerscape® Access LA9310 Programmable Baseband Processor

Network Listening Module

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ブロック図

Layerscape Access LA9310 Block Diagram

Layerscape Access LA9310 Block Diagram

Features

Core and Memory Complex

  • One VSPA generation 2, 16AU DSP at up to 614MHz (~80 GFLOP)
  • One M4 32b Arm® core at up to 307MHz

Connectivity and I/O

  • One PCIe Gen3 lane
  • Five {I+Q} ADCs, each sampling at up to 153M samples per second
  • One {I+Q} DAC, sampling at up to 153M samples per second

Acceleration

  • Forward error correction for proprietary communication protocols
  • DMA for internal and host side data movement

Low speed I/O and RFIC control

  • General purpose single lane SPI with four Chip Selects
  • Lightweight LVDS Communication Protocol for RFIC Interface
  • I²C controller
  • UART
  • JTAG

Device

  • 8mm x 8mm package
  • 1.5W total max power at 105C

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N true 0 PSPLA9310ja 6 アプリケーション・ノート Application Note t789 3 ファクト・シート Fact Sheet t523 2 製品概要 Product Brief t532 1 ja ja ja アプリケーション・ノート Application Note 3 1 0 English This application note introduces the LS1xxxx and LS2xxxx devices Thermal Management Unit (TMU). TMU Thermal Measurement Temperature Sensor Heat power 1651046281017726871122 PSP 241.6 KB None None documents None 1651046281017726871122 /docs/en/application-note/AN12310.pdf 241590 /docs/en/application-note/AN12310.pdf AN12310 documents N N 2022-04-27 Thermal Management Unit Usage /docs/en/application-note/AN12310.pdf /docs/en/application-note/AN12310.pdf Application Note N 645036621402383989 2024-12-13 pdf N en Apr 27, 2022 645036621402383989 Application Note Y N Thermal Management Unit Usage 2 1 English Solder joint and package temperature for Pb-free BGA in SnPB and Pb-free solders in IR or convection reflow ovens are discussed in this document. 1154542630989715908212 PSP 281.6 KB None None documents None 1154542630989715908212 /docs/en/application-note/AN3300.pdf 281637 /docs/en/application-note/AN3300.pdf AN3300 documents N N 2017-08-17 General soldering Temperature Process Guidelines /docs/en/application-note/AN3300.pdf /docs/en/application-note/AN3300.pdf Application Note N 645036621402383989 2022-12-07 pdf N en Aug 16, 2017 645036621402383989 Application Note Y N General soldering Temperature Process Guidelines 3 0 English This document demonstrates how to determine the package temperature and thermal mass dependent moisture sensitivity level (MSL) of products to ensure reliable processing of moisture sensitive surface mount components. Comply with these recommendations to maintain package integrity of components during any heat exposure of board soldering and de-soldering. 1154542628855726115465 PSP 151.6 KB None None documents None 1154542628855726115465 /docs/en/application-note/AN3298.pdf 151612 /docs/en/application-note/AN3298.pdf AN3298 documents N N 2016-10-31 Solder Joint Temperature and Package Peak Temperature /docs/en/application-note/AN3298.pdf /docs/en/application-note/AN3298.pdf Application Note N 645036621402383989 2022-12-07 pdf N en Aug 2, 2006 645036621402383989 Application Note Y N Solder Joint Temperature and Package Peak Temperature ファクト・シート Fact Sheet 2 4 0 English Non Terrestrial Network (NTN) is a market where NXP products are well-positioned, with continued focus on power efficiency and reliable compute. 1723230543628708110179 PSP 279.3 KB None None documents Override 1723230543628708110179 /docs/en/fact-sheet/1799386-CS_Non terrestrial networks NTN Fact Sheet-LR.pdf 279270 /docs/en/fact-sheet/1799386-CS_Non terrestrial networks NTN Fact Sheet-LR.pdf NTN-FS documents N 2024-08-09 Non-Terrestrial Networking: Extending the Internet to Space /docs/en/fact-sheet/1799386-CS_Non terrestrial networks NTN Fact Sheet-LR.pdf /docs/en/fact-sheet/1799386-CS_Non terrestrial networks NTN Fact Sheet-LR.pdf Fact Sheet N 736675474163315314 2024-08-09 pdf en Aug 5, 2024 736675474163315314 Fact Sheet Y N Non-Terrestrial Networking: Extending the Internet to Space 5 0 English The Layerscape® Access LA9310 programmable baseband processor is a digital signal processor with integrated data converters (ADC/DAC) targeting physical layer processing of 5G infrastructure, digital front end (DFE) and custom communication-related systems at the edge of the network. Its low cost and power and programmable signal processing capabilities make it an attractive option to expensive FPGAs in applications such as network listening, small-scale radio units and repeaters. 1643039836667704250967 PSP 5.0 MB None None documents None 1643039836667704250967 /docs/en/fact-sheet/LA9310-FS.pdf 4991188 /docs/en/fact-sheet/LA9310-FS.pdf LA9310-FS documents N N 2022-01-24 LAYERSCAPE® ACCESS LA9310 PROGRAMMABLE BASEBAND PROCESSOR /docs/en/fact-sheet/LA9310-FS.pdf /docs/en/fact-sheet/LA9310-FS.pdf Fact Sheet N 736675474163315314 2022-12-07 pdf N en Jan 24, 2022 736675474163315314 Fact Sheet Y N LAYERSCAPE® ACCESS LA9310 PROGRAMMABLE BASEBAND PROCESSOR 製品概要 Product Brief 1 6 1 English NLM is a small form factor (credit card sized) PCIe based card, that sniffs the RF signal over the air and extracts the synchronization signal from the base station. 1679333716741690723532 PSP 164.3 KB None None documents None 1679333716741690723532 /docs/en/product-brief/PBNLMPRODBRIEF.pdf 164264 /docs/en/product-brief/PBNLMPRODBRIEF.pdf PBNLMPRODBRIEF documents N N 2023-03-20 NXP Network Listening Module (NLM) Platform /docs/en/product-brief/PBNLMPRODBRIEF.pdf /docs/en/product-brief/PBNLMPRODBRIEF.pdf Product Brief N 899114358132306053 2023-03-22 pdf N en Mar 20, 2023 899114358132306053 Product Brief Y N NXP Network Listening Module (NLM) Platform false 0 LA9310 downloads ja true 1 Y PSP Y Y アプリケーション・ノート 3 /docs/en/application-note/AN12310.pdf 2022-04-27 1651046281017726871122 PSP 1 Apr 27, 2022 Application Note This application note introduces the LS1xxxx and LS2xxxx devices Thermal Management Unit (TMU). TMU Thermal Measurement Temperature Sensor Heat power None /docs/en/application-note/AN12310.pdf English documents 241590 None 645036621402383989 2024-12-13 N /docs/en/application-note/AN12310.pdf Thermal Management Unit Usage /docs/en/application-note/AN12310.pdf documents 645036621402383989 Application Note N en None Y pdf 0 N N Thermal Management Unit Usage 241.6 KB AN12310 N 1651046281017726871122 /docs/en/application-note/AN3300.pdf 2017-08-17 1154542630989715908212 PSP 2 Aug 16, 2017 Application Note Solder joint and package temperature for Pb-free BGA in SnPB and Pb-free solders in IR or convection reflow ovens are discussed in this document. None /docs/en/application-note/AN3300.pdf English documents 281637 None 645036621402383989 2022-12-07 N /docs/en/application-note/AN3300.pdf General soldering Temperature Process Guidelines /docs/en/application-note/AN3300.pdf documents 645036621402383989 Application Note N en None Y pdf 1 N N General soldering Temperature Process Guidelines 281.6 KB AN3300 N 1154542630989715908212 /docs/en/application-note/AN3298.pdf 2016-10-31 1154542628855726115465 PSP 3 Aug 2, 2006 Application Note This document demonstrates how to determine the package temperature and thermal mass dependent moisture sensitivity level (MSL) of products to ensure reliable processing of moisture sensitive surface mount components. Comply with these recommendations to maintain package integrity of components during any heat exposure of board soldering and de-soldering. None /docs/en/application-note/AN3298.pdf English documents 151612 None 645036621402383989 2022-12-07 N /docs/en/application-note/AN3298.pdf Solder Joint Temperature and Package Peak Temperature /docs/en/application-note/AN3298.pdf documents 645036621402383989 Application Note N en None Y pdf 0 N N Solder Joint Temperature and Package Peak Temperature 151.6 KB AN3298 N 1154542628855726115465 ファクト・シート 2 /docs/en/fact-sheet/1799386-CS_Non terrestrial networks NTN Fact Sheet-LR.pdf 2024-08-09 1723230543628708110179 PSP 4 Aug 5, 2024 Fact Sheet Non Terrestrial Network (NTN) is a market where NXP products are well-positioned, with continued focus on power efficiency and reliable compute. None /docs/en/fact-sheet/1799386-CS_Non terrestrial networks NTN Fact Sheet-LR.pdf English documents 279270 None 736675474163315314 2024-08-09 /docs/en/fact-sheet/1799386-CS_Non terrestrial networks NTN Fact Sheet-LR.pdf Non-Terrestrial Networking: Extending the Internet to Space /docs/en/fact-sheet/1799386-CS_Non terrestrial networks NTN Fact Sheet-LR.pdf documents 736675474163315314 Fact Sheet N en Override Y pdf 0 N Non-Terrestrial Networking: Extending the Internet to Space 279.3 KB NTN-FS N 1723230543628708110179 /docs/en/fact-sheet/LA9310-FS.pdf 2022-01-24 1643039836667704250967 PSP 5 Jan 24, 2022 Fact Sheet The Layerscape® Access LA9310 programmable baseband processor is a digital signal processor with integrated data converters (ADC/DAC) targeting physical layer processing of 5G infrastructure, digital front end (DFE) and custom communication-related systems at the edge of the network. Its low cost and power and programmable signal processing capabilities make it an attractive option to expensive FPGAs in applications such as network listening, small-scale radio units and repeaters. None /docs/en/fact-sheet/LA9310-FS.pdf English documents 4991188 None 736675474163315314 2022-12-07 N /docs/en/fact-sheet/LA9310-FS.pdf LAYERSCAPE® ACCESS LA9310 PROGRAMMABLE BASEBAND PROCESSOR /docs/en/fact-sheet/LA9310-FS.pdf documents 736675474163315314 Fact Sheet N en None Y pdf 0 N N LAYERSCAPE® ACCESS LA9310 PROGRAMMABLE BASEBAND PROCESSOR 5.0 MB LA9310-FS N 1643039836667704250967 製品概要 1 /docs/en/product-brief/PBNLMPRODBRIEF.pdf 2023-03-20 1679333716741690723532 PSP 6 Mar 20, 2023 Product Brief NLM is a small form factor (credit card sized) PCIe based card, that sniffs the RF signal over the air and extracts the synchronization signal from the base station. None /docs/en/product-brief/PBNLMPRODBRIEF.pdf English documents 164264 None 899114358132306053 2023-03-22 N /docs/en/product-brief/PBNLMPRODBRIEF.pdf NXP Network Listening Module (NLM) Platform /docs/en/product-brief/PBNLMPRODBRIEF.pdf documents 899114358132306053 Product Brief N en None Y pdf 1 N N NXP Network Listening Module (NLM) Platform 164.3 KB PBNLMPRODBRIEF N 1679333716741690723532 true Y Products

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