Features
Battery Cell Controller, Advanced, 6 Channels, TPL, LQFP48.
Package
HLQFP48 LQFP64, plastic, low profile quad flat package; 64 terminals; 0.5 mm pitch; 10 mm x 10 mm x 1.4 mm body.
購入オプション
88W8997-A1-CBQE/AZ
アクティブ
12NC: 935391308092
詳細
注文
操作機能
情報なし
環境
| Part/12NC | 鉛フリー | EU RoHS | ハロゲンフリー | RHFインジケーター | REACH SVHC | Weight (mg) |
|---|---|---|---|---|---|---|
88W8997-A1-CBQE/AZ(935391308092) | Yes | Yes Certificate Of Analysis (CoA) | Yes |  | REACH SVHC | 27.218956 |
品質
| Part/12NC | 安全保障機能安全 | 吸湿感度レベル (MSL) | Peak Package Body Temperature (PPT) (C°) | ||
|---|---|---|---|---|---|
| 鉛フリーはんだ | 鉛フリーはんだ | ||||
88W8997-A1-CBQE/AZ (935391308092) | No | 1 | 260 | ||
配送
| Part/12NC | 関税分類番号（米国)免責事項: | 輸出規制品目番号（米国） | CCATS |
|---|---|---|---|
88W8997-A1-CBQE/AZ (935391308092) | 854231 | 5A992C | G183578 |
詳細 88W8997
The 88W8997 is the industry’s first 28nm, 802.11ac wave-2, 2x2 MU-MIMO combo solution with full support for Bluetooth 5.3. The design enhancements and the low power 28nm process technology reduces the power consumption by up to 40% over existing solutions. 88W8997 features the highest level of integration in the market including dual band Power Amplifiers (PAs), Low Noise Amplifiers (LNAs) and switches reducing board level BOM (Bill of Materials) to the bare minimum, enabling easy Chip-on-Board and module design for board markets.
Wireless modules based on the NXP 88W8997 are offered by leading module manufacturers.