Features
Battery Cell Controller, Advanced, 6 Channels, TPL, LQFP48.
Package
HLQFP48 LQFP64, plastic, low profile quad flat package; 64 terminals; 0.5 mm pitch; 10 mm x 10 mm x 1.4 mm body.
Battery Cell Controller, Advanced, 6 Channels, TPL, LQFP48.
HLQFP48 LQFP64, plastic, low profile quad flat package; 64 terminals; 0.5 mm pitch; 10 mm x 10 mm x 1.4 mm body.
HSOP32: HSOP32, plastic, thermal enhanced small outline package; 32 terminals; 0.65 mm pitch; 7.5 mm x 11 mm x 2.33 mm body
12NC: 935331842574
詳細
注文
Normally ships in 1-2 business days.
代理店からの注文12NC: 935331842518
詳細
注文
パラメータ | 値 |
---|---|
Supply Voltage [Min to Max] (V) | 5.5 to 28 |
Device Function | comm transceivers, linear regulators, system basis chip |
Data Rate [max] kbps | 1000.0 |
パラメータ | 値 |
---|---|
Protection | overtemperature, overvoltage protect, undervoltage |
Additional Features - Security | SPI |
Diagnostics | SPI |
Part/12NC | 鉛フリー | EU RoHS | ハロゲンフリー | RHFインジケーター | 2次インターコネクト | REACH SVHC | Weight (mg) |
---|---|---|---|---|---|---|---|
MCZ33904D3EK(935331842574) | Yes | Yes Certificate Of Analysis (CoA) | Yes | e3 | REACH SVHC | 486.76 | |
MCZ33904D3EKR2(935331842518) | Yes | Yes Certificate Of Analysis (CoA) | Yes | e3 | REACH SVHC | 486.76 |
Part/12NC | 安全保障機能安全 | 吸湿感度レベル (MSL) | Peak Package Body Temperature (PPT) (C°) | Maximum Time at Peak Temperatures (s) | |||
---|---|---|---|---|---|---|---|
鉛フリーはんだ | 鉛フリーはんだ | 鉛フリーはんだ | |||||
MCZ33904D3EK (935331842574) | No | 3 | 260 | 40 | |||
MCZ33904D3EKR2 (935331842518) | No | 3 | 260 | 40 |
Part/12NC | 関税分類番号(米国)免責事項: | 輸出規制品目番号(米国) |
---|---|---|
MCZ33904D3EK (935331842574) | 854239 | EAR99 |
MCZ33904D3EKR2 (935331842518) | 854239 | EAR99 |
Part/12NC | 発行日 | 有効期限 | PCN | タイトル |
---|---|---|---|---|
MCZ33904D3EK (935331842574) | 2020-12-15 | 2020-12-16 | 202011011I | NXP Will Add a Sealed Date to the Product Label |
MCZ33904D3EKR2 (935331842518) | ||||
MCZ33904D3EK (935331842574) | 2017-12-20 | 2018-01-03 | 201710023I | New PQ Label Input for Non-MPQ Shipments |
The NXP MC33904 is a device in the second generation family of system basis chips, combining several features and enhanced module designs.