MC33742 | SBC with Enhanced High-Speed CAN Transceiver | NXP Semiconductors

SBC with Enhanced High-Speed CAN Transceiver

製品画像を見る

ブロック図

MC33742 SBC with Enhanced High-Speed CAN Transceiver

MC33742 SBC with Enhanced High-Speed CAN Transceiver

Features

Key Features

  • High-Speed 1.0 Mbps CAN Interface with Bus Diagnostic Capability (Detection of CANH and CANL Short to Ground, to VDD, and to VSUP)
  • Low-Drop Voltage 5.0 V, 200 mA VDD Regulator with Current-Limiting, Overtemperature Pre-Warning, and Output Monitoring with Reset
  • Additional 5.0 V Regulator with External Series Pass Transistor
  • Normal, Standby, Stop, and Sleep Modes with Low Sleep and Stop Mode Current
  • 150 mA High-Side Switch Output for Control of External Circuitry
  • Four External Wake-Up Inputs
  • Software-Programmable Watchdog Window, Interrupt, and Reset

購入/パラメータ










































































































N true 0 PSPMC33742ja 7 アプリケーション・ノート Application Note t789 4 エラッタ Errata t522 1 データ・シート Data Sheet t520 1 パッケージ情報 Package Information t790 1 ja 3 1 15.0 English The 33742 and the 33742S are SPI-controlled System Basis Chips, along with a CAN 2.0-compliant transceiver, used in many automotive electronic control units. 1097878942252700681220 PSP 3.4 MB None None documents None 1097878942252700681220 /docs/en/data-sheet/MC33742.pdf 3436510 /docs/en/data-sheet/MC33742.pdf MC33742 N N 2016-10-31 MC33742, System Basis Chip (SBC) with enhanced High Speed CAN Transceiver - Data Sheet /docs/en/data-sheet/MC33742.pdf /docs/en/data-sheet/MC33742.pdf Data Sheet N Y 980000996212993340 2022-12-07 pdf N en Dec 8, 2014 Data Sheet t520 データ・シート Data Sheet Y N MC33742, System Basis Chip (SBC) with enhanced High Speed CAN Transceiver - Data Sheet 2 3.0 English This application note provides guidelines for handling and assembly of SOIC package during Printed Circuit Board (PCB) assembly. 10jsBvfc PSP 3.5 MB None None documents None 10jsBvfc /docs/en/application-note/AN2409.pdf 3536520 /docs/en/application-note/AN2409.pdf AN2409 N N 2016-10-31 AN2409, Small Outline Integrated Circuit (SOIC) Package - Application Note /docs/en/application-note/AN2409.pdf /docs/en/application-note/AN2409.pdf Application Note N Y 645036621402383989 2024-01-19 pdf N en Oct 21, 2014 Application Note t789 アプリケーション・ノート Application Note Y N AN2409, Small Outline Integrated Circuit (SOIC) Package - Application Note 3 9.0 English Provides Assembly guidelines for QFN and SON packages handling and board mounting. Including recommendations for printed-circuit board (PCB) design, soldering, and rework. NOTE: combined with AN10365. 112GNLnm PSP 9.3 MB None None documents None 112GNLnm /docs/en/application-note/AN1902.pdf 9332633 /docs/en/application-note/AN1902.pdf AN1902 N N 2016-10-31 AN1902: Assembly Guidelines for QFN and SON Packages Application Note /docs/en/application-note/AN1902.pdf /docs/en/application-note/AN1902.pdf Application Note N Y 645036621402383989 2023-06-08 pdf N en Mar 30, 2021 Application Note t789 アプリケーション・ノート Application Note Y N AN1902: Assembly Guidelines for QFN and SON Packages Application Note false ja ja アプリケーション・ノート Application Note 2 4 1.0 English This document presents the main concepts behind the wheel location algorithm of the KWL software. The document details the approach used and explains how this led to the current implementation. 1485456925034706793334 PSP 6.7 MB Registration without Disclaimer None documents Extended 1485456925034706793334 /secured/assets/documents/en/application-note/AN5322.pdf 6749797 /secured/assets/documents/en/application-note/AN5322.pdf AN5322 documents Y N 2017-01-26 AN5322: TPMS Wheel Location Introduction and Main Concepts Application Note /webapp/Download?colCode=AN5322&lang_cd=ja /secured/assets/documents/en/application-note/AN5322.pdf Application Note N 645036621402383989 2024-01-19 pdf Y en Jan 25, 2017 645036621402383989 Application Note Y N AN5322: TPMS Wheel Location Introduction and Main Concepts Application Note 5 1.0 English The MC33781 and MC33784 together constitute NXP Semiconductors's implementation of the Distributed System Interface (DSI) Bus Standard, Version 2.02. 1225311007711718167766 PSP 1.0 MB None None documents None 1225311007711718167766 /docs/en/application-note/AN3670.pdf 1013814 /docs/en/application-note/AN3670.pdf AN3670 documents N N 2016-10-31 AN3670, Implementing a DSI Network Using the MC33781 and the MC33784 /docs/en/application-note/AN3670.pdf /docs/en/application-note/AN3670.pdf Application Note N 645036621402383989 2024-01-19 pdf N en Oct 29, 2008 645036621402383989 Application Note Y N AN3670, Implementing a DSI Network Using the MC33781 and the MC33784 エラッタ Errata 1 6 1 English UNEXPECTED RESET, Following specific timing between SPI commands and upon a device mode change via an MCR register write command, an unexpected reset could be generated. 1158190748116739708178 PSP 107.5 KB None None documents None 1158190748116739708178 /docs/en/errata/MC33742ER.pdf 107467 /docs/en/errata/MC33742ER.pdf MC33742ER documents N N 2016-10-31 MC33742S, Sillicon Mask Eratta /docs/en/errata/MC33742ER.pdf /docs/en/errata/MC33742ER.pdf Errata N 155452329886410597 2024-01-19 pdf N en Sep 13, 2006 155452329886410597 Errata Y N MC33742S, Sillicon Mask Eratta パッケージ情報 Package Information 1 7 2.0 English System Basis Chip (SBC) with Enhanced High-Speed CAN Transceiver Thermal Addendum 1176137997163707951999 PSP 147.8 KB None None documents None 1176137997163707951999 /docs/en/package-information/MC33742DWTAD.pdf 147801 /docs/en/package-information/MC33742DWTAD.pdf MC33742DWTAD documents N N 2016-10-31 MC33742DWTAD, System Basis Chip (SBC) with Enhanced High-Speed CAN Transceiver Thermal Addendum /docs/en/package-information/MC33742DWTAD.pdf /docs/en/package-information/MC33742DWTAD.pdf Package Information N 302435339416912908 2024-01-23 pdf N en Apr 20, 2007 302435339416912908 Package Information Y N MC33742DWTAD, System Basis Chip (SBC) with Enhanced High-Speed CAN Transceiver Thermal Addendum false 0 MC33742 downloads ja true 1 Y PSP アプリケーション・ノート 4 /secured/assets/documents/en/application-note/AN5322.pdf 2017-01-26 1485456925034706793334 PSP 4 Jan 25, 2017 Application Note This document presents the main concepts behind the wheel location algorithm of the KWL software. The document details the approach used and explains how this led to the current implementation. Registration without Disclaimer /secured/assets/documents/en/application-note/AN5322.pdf English documents 6749797 None 645036621402383989 2024-01-19 Y /webapp/Download?colCode=AN5322&lang_cd=ja AN5322: TPMS Wheel Location Introduction and Main Concepts Application Note /secured/assets/documents/en/application-note/AN5322.pdf documents 645036621402383989 Application Note N en Extended Y pdf 1.0 Y N AN5322: TPMS Wheel Location Introduction and Main Concepts Application Note 6.7 MB AN5322 N 1485456925034706793334 /docs/en/application-note/AN3670.pdf 2016-10-31 1225311007711718167766 PSP 5 Oct 29, 2008 Application Note The MC33781 and MC33784 together constitute NXP Semiconductors's implementation of the Distributed System Interface (DSI) Bus Standard, Version 2.02. None /docs/en/application-note/AN3670.pdf English documents 1013814 None 645036621402383989 2024-01-19 N /docs/en/application-note/AN3670.pdf AN3670, Implementing a DSI Network Using the MC33781 and the MC33784 /docs/en/application-note/AN3670.pdf documents 645036621402383989 Application Note N en None Y pdf 1.0 N N AN3670, Implementing a DSI Network Using the MC33781 and the MC33784 1.0 MB AN3670 N 1225311007711718167766 /docs/en/application-note/AN2409.pdf 2016-10-31 10jsBvfc PSP 2 Oct 21, 2014 Application Note アプリケーション・ノート This application note provides guidelines for handling and assembly of SOIC package during Printed Circuit Board (PCB) assembly. None /docs/en/application-note/AN2409.pdf English 3536520 None Application Note 2024-01-19 N /docs/en/application-note/AN2409.pdf AN2409, Small Outline Integrated Circuit (SOIC) Package - Application Note /docs/en/application-note/AN2409.pdf documents 645036621402383989 Application Note N Y en None Y t789 pdf 3.0 N N AN2409, Small Outline Integrated Circuit (SOIC) Package - Application Note 3.5 MB AN2409 N 10jsBvfc /docs/en/application-note/AN1902.pdf 2016-10-31 112GNLnm PSP 3 Mar 30, 2021 Application Note アプリケーション・ノート Provides Assembly guidelines for QFN and SON packages handling and board mounting. Including recommendations for printed-circuit board (PCB) design, soldering, and rework. NOTE: combined with AN10365. None /docs/en/application-note/AN1902.pdf English 9332633 None Application Note 2023-06-08 N /docs/en/application-note/AN1902.pdf AN1902: Assembly Guidelines for QFN and SON Packages Application Note /docs/en/application-note/AN1902.pdf documents 645036621402383989 Application Note N Y en None Y t789 pdf 9.0 N N AN1902: Assembly Guidelines for QFN and SON Packages Application Note 9.3 MB AN1902 N 112GNLnm エラッタ 1 /docs/en/errata/MC33742ER.pdf 2016-10-31 1158190748116739708178 PSP 6 Sep 13, 2006 Errata UNEXPECTED RESET, Following specific timing between SPI commands and upon a device mode change via an MCR register write command, an unexpected reset could be generated. None /docs/en/errata/MC33742ER.pdf English documents 107467 None 155452329886410597 2024-01-19 N /docs/en/errata/MC33742ER.pdf MC33742S, Sillicon Mask Eratta /docs/en/errata/MC33742ER.pdf documents 155452329886410597 Errata N en None Y pdf 1 N N MC33742S, Sillicon Mask Eratta 107.5 KB MC33742ER N 1158190748116739708178 データ・シート 1 /docs/en/data-sheet/MC33742.pdf 2016-10-31 1097878942252700681220 PSP 1 Dec 8, 2014 Data Sheet データ・シート The 33742 and the 33742S are SPI-controlled System Basis Chips, along with a CAN 2.0-compliant transceiver, used in many automotive electronic control units. None /docs/en/data-sheet/MC33742.pdf English 3436510 None Data Sheet 2022-12-07 N /docs/en/data-sheet/MC33742.pdf MC33742, System Basis Chip (SBC) with enhanced High Speed CAN Transceiver - Data Sheet /docs/en/data-sheet/MC33742.pdf documents 980000996212993340 Data Sheet N Y en None Y t520 pdf 15.0 N N MC33742, System Basis Chip (SBC) with enhanced High Speed CAN Transceiver - Data Sheet 3.4 MB MC33742 N 1097878942252700681220 パッケージ情報 1 /docs/en/package-information/MC33742DWTAD.pdf 2016-10-31 1176137997163707951999 PSP 7 Apr 20, 2007 Package Information System Basis Chip (SBC) with Enhanced High-Speed CAN Transceiver Thermal Addendum None /docs/en/package-information/MC33742DWTAD.pdf English documents 147801 None 302435339416912908 2024-01-23 N /docs/en/package-information/MC33742DWTAD.pdf MC33742DWTAD, System Basis Chip (SBC) with Enhanced High-Speed CAN Transceiver Thermal Addendum /docs/en/package-information/MC33742DWTAD.pdf documents 302435339416912908 Package Information N en None Y pdf 2.0 N N MC33742DWTAD, System Basis Chip (SBC) with Enhanced High-Speed CAN Transceiver Thermal Addendum 147.8 KB MC33742DWTAD N 1176137997163707951999 true Y Products

ドキュメント

クイック・リファレンス ドキュメンテーションの種類.

7 ドキュメント

コンパクトリスト

アプリケーション・ノート (4)
エラッタ (1)
データ・シート (1)
パッケージ情報 (1)

デザイン・ファイル

ハードウェア

クイック・リファレンス ボードタイプ.

1 ハードウェア提供

  • Charge Control L
    コンパニオン・シリコンとモジュール

    Charge Control LNEW

この製品をサポートするその他のパートナー製品を見つけるには、当社の Web サイトにアクセスしてください パートナーマーケットプレイス.

エンジニアリング・サービス

1 エンジニアリング・サービス

この製品をサポートするその他のパートナー製品を見つけるには、当社の Web サイトにアクセスしてください パートナーマーケットプレイス.

サポート

お困りのことは何ですか??